640×512/12μm Array Uncooled Infrared Focal Plane Microbolometer GH-LWA-612AC

The GH-LWA-612AC is an uncooled long-wave infrared photodetector that uses a microbolometer with vanadium oxide material to convert infrared radiation into electrical signals. It can be integrated into infrared thermal imaging cameras. The GH-LWA-612AC is a focal plane array composed of a silicon-based readout circuit and a MEMS pixel array with a 12μm pixel size. It is vacuum-sealed within a ceramic package without a thermoelectric cooler (TEC).


Specification of 640×512/12μm Array Uncooled Infrared Focal Plane Microbolometer GH-LWA-612AC

  • 640x512 array size

  • 12μm pixel size

  • Operating wavelength range: 8μm to 14μm

  • Frame rate: 25~60Hz

  • NETD < 40mK (F/1, 300K, 50Hz)

  • Thermal time constant: 8-10ms

  • Power supply: VSK=4.6V (typical), VDDA=3.6V, VDDD=1.8V

  • Low power consumption<150mW @50Hz

  • Fully digital interface, no external DAC/ADC required

  • Digital interface, 4-port 16-bit digital output with synchronous clock, 4-bit single-port input pixel OCC, external frame synchronization and asynchronous reset,<100MHz input clock @60fps

  • Supports applications without TEC and shutter

  • Operating temperature range: -40°C to +65°C

  • Available in 36PIN PGA, 32PIN PGA, 30PIN PGA, 32PIN PGA dual-row ceramic package

  • Package dimensions: 24x24x3.9mm, 22x22x3.9mm, 20x20x4.1mm, 22.86x22.86x4.5mm


Applications of 640×512/12μm Array Uncooled Infrared Focal Plane Microbolometer GH-LWA-612AC

  • Observation and targeting

  • Industrial temperature measurement

  • Security surveillance

  • Firefighting and rescue

  • Automotive night vision

  • Building inspection

  • Medical and health


Product Focus of 640×512/12μm Array Uncooled Infrared Focal Plane Microbolometer GH-LWA-612AC

  • The GH-LWA-612AC uses a digital readout with a built-in 14-bit column-level ADC and outputs data through a 4-port CMOS format. The data format can be configured as binary or Gray code, with a single-port data rate of 78Mbps @50fps. The GH-LWA-612AC also provides a synchronous sampling clock (ADSCL) for data synchronization.

  • The GH-LWA-612AC adopts a simple power supply and reference input method. The analog power supply is 3.6V, the detector's low-noise power supply VSK is typically 4.6V (adjustable based on noise and gain requirements), and the external low-noise reference input is 2.5V. The digital power supply VDDD is 1.8V (VDDD and VDDIO can be separated, and VDDIO supports 1.8-3.3V).

  • The GH-LWA-612AC features a new low-power readout architecture, with total power consumption under 130mW at a high frame rate of 50Hz, minimizing the impact of detector heat on performance.

  • The GH-LWA-612AC supports on-sensor 4-bit per-pixel offset NUC, global offset correction, and temperature drift correction to ensure dynamic range of the readout.

  • The GH-LWA-612AC allows adjustment of the channel response in multiple dimensions, meeting the wide dynamic range needs of industrial temperature measurement, and supports achieving the best signal-to-noise ratio in high-gain + long integration time mode.


640×512/12μm Array Uncooled Infrared Focal Plane Microbolometer GH-LWA-612AC


Figure 1. Functional Block Diagram of the GH-LWA-612AC Detector (only essential connection pins labeled)

Specifications of 640×512/12μm Array Uncooled Infrared Focal Plane Microbolometer GH-LWA-612AC

Definition

Description

Represent active value

Remarks

Sensor

Uncooled VOx

Micro radiation bolometer



Spectral coverage

Long-wave IR, from 8 μ m to 14 μ m



Array size

640x512


Excludes peripheral dummy pixel rows (the array size including peripheral dummy pixel rows is 644x516).

Package

32-tube pin PGA ceramic package



Pixel size

12μm



Frame frequency

25~60Hz

50Hz


ADC bit

14bit



Thermal sensitivity

Temporal NETD

≤40mK

@F =1,T =300K,50Hz

Integration capacitor range

8

4pF

2pF ~9pF

Digital output

The 4-port CMOS logic level


Contains the temperature- sensing output

Input main clock frequency

(fSCL)

39.1 ~93.8MHz

80MHz

At 50Hz to work

Control protocol

SPI


External frame sync

Power voltage

3.6V/1.8V


Digital I/O compatible with 3.3V/1.8V: For 50/60Hz applications, 3.3V is recommended; for 25/30Hz applications, both 3.3V and 1.8V are acceptable

Detector power supply VSK

4.4~4.8V

4.6 V


Power dissipation

80 ~150mW

130mW

@T =300K,50Hz

Package

36-pin PGA ceramic package


Or 32 pin PGA ceramic package,

30-pin PGA ceramic package

Size

24x24x3.9mm


Or 22x22x3.9mm, 20x20x4.1mm, 22.86x22.86x3.625mm are all acceptable

Weight

≤8g



Operating temperature range

-40 ~65℃

27℃

Without TEC


Description of the operational rate index

The detector operability is greater than 99.5%, i. e., within the 640 x 512 array region.

(1) No bad line or bad row.

(2) The maximum number of bad cluster size in the central area (160×120) shall not exceed 8 blind pixels.

(3) The maximum number of bad clusters outside the central area does not exceed 14 blind pixels, and the number of clusters with 9 to 14 blind pixels does not exceed



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